1, For Wafer :
        型號       總厚度    基材厚度    膠層厚度            特性
No.6360-00  T:100um  PO:90um   Adhesive:10um  Standard

No.6360-20  T:100um  PO:90um   Adhesive:10um  High adhesion for chip flying

No.6360-50 T:100um  PO:90um    Adhesive:10um  Easy pick-up

No.6360-80 T:110um  PO:100um  Adhesive:10um  Excellent chipping resistance

2, For Substrate:
       型號        總厚度    基材厚度    膠層厚度            特性
No.6360-15 T:160um  PO:150um  Adhesive:10um  Standard

No.6360-25 T:160um  PO:150um  Adhesive:10um  High adhesion
 
No.6360-55 T:160um  PO:150um  Adhesive:10um  Easy pick-up

No.6360-95 T:170um  PO:150um  Adhesive:20um  For high bumpy surfac

一般物理特性
 Slion Dicing Tape series (for Wafer)

 Slion Dicing Tape series (for Substrate)